The Wireless Golden Gateway: Why Advanced Packaging Professionals Should Attend IMS 2025

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The IEEE MTTS International Microwave Symposium attracts over 9,000 attendees and 500+ exhibitors to share cutting-edge developments in RF, microwave, and advanced packaging technologies. Tim Hancock and Jim Buckwalter from the IMS committee explain why this premier event, taking place in San Francisco's Moscone Center from June 15-20, has become increasingly relevant to professionals in advanced packaging and heterogeneous integration.
• Approximately 15% of accepted papers directly address packaging and heterogeneous integration topics
• Papers undergo rigorous double-blind review with an in-person committee meeting to ensure highest quality content
• Technical focus includes laminate technology, chip stacking, thermal management, and other critical packaging technologies
• Special workshops address 3D heterogeneous integration, millimeter-wave phased arrays, and advanced packaging solutions
• Exhibition floor features 500+ companies providing networking opportunities and technology discovery
• Student programs include design competitions, volunteer opportunities, and dedicated sessions for underrepresented groups
• Early bird registration ends May 16th with regular registration continuing at ims-ieee.org
Register at ims-ieee.org to secure your spot and book accommodations before they fill up.

THE 2025 IEEE MTT-S IMS
The 2025 IEEE MTT-S IMS is the largest event for RF and microwave professionals in the world.
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