Chip Champions: How The 3D InCites Award Winners Are Revolutionizing Heterogeneous Integration

3D InCites Podcast

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The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year's award winners in heterogeneous integration and chiplet technology.
• SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniformity across square substrates
• Eric Gongora, of MacDermid Alpha, explains how NovaFab fine-grained copper enables hybrid bonding with customizable annealing times and improved electron migration resistance
• Chuck Woychik, NHanced Semiconductors, talks about how the company brings hybrid bonding capabilities onshore with expertise in wafer processing for both defense and commercial applications
• Keith Felton, Siemens Digital Industries Software, introduces Innovator 3DIC for hierarchical device planning that automatically propagates design changes throughout chiplet interfaces
• Kazuyuki Mitsukura explains how Resonac builds collaborative consortia in Japan and the US to solve complex advanced packaging challenges through shared resources
• Rex Anderson from Micross shares his engineering journey and passion for mentoring the ne

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KLA provides semiconductor equipment for metrology, inspection, wafer processing, and more.
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Chapters

1. Chip Champions: How The 3D InCites Award Winners Are Revolutionizing Heterogeneous Integration (00:00:00)

2. Episode Introduction (00:00:08)

3. ACM Research: Horizontal Rotation Plating (00:00:50)

4. MacDermid Alpha: Chemistry for Hybrid Bonding (00:09:21)

5. [Ad] Digital Disruption with Geoff Nielson (00:16:09)

6. (Cont.) MacDermid Alpha: Chemistry for Hybrid Bonding (00:16:51)

7. NHanced Semiconductors: 3D Hybrid Integration (00:19:31)

8. Siemens: Hierarchical Device Planning Tool (00:24:55)

9. Resonac: Joint Consortium Initiative (00:34:22)

10. Rex Anderson: Engineer of the Year (00:40:09)

11. Saras Micro Devices: Vertical Power Delivery (00:48:50)

12. Episode Wrap-up (00:59:11)