Artwork

Content provided by Embedded Computing Design. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by Embedded Computing Design or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://ppacc.player.fm/legal.
Player FM - Podcast App
Go offline with the Player FM app!

A Modular Future: Chiplets, AI, and Advanced Packaging

45:37
 
Share
 

Manage episode 466500884 series 2625347
Content provided by Embedded Computing Design. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by Embedded Computing Design or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://ppacc.player.fm/legal.

Send us a text

On this episode of Embedded Insiders, Ken sits down with Rozalia Beica, Field CTO at Rapidus Corporation, to explore the rise of chiplet integration, Rapidus' U.S. expansion, the transformative role of AI in semiconductors, and the growing importance of advanced packaging in the industry. Stay tuned for insights into how Rapidus is shaping the future of semiconductor technology.

Next, Ken discusses how customer experience centers are driving innovation in complex embedded systems.

But first, Rich and Ken highlight some important industry news involving, you guessed it, AI. They’re also sharing some information ahead of embedded world 2025

For more information, visit embeddedcomputing.com

  continue reading

269 episodes

Artwork
iconShare
 
Manage episode 466500884 series 2625347
Content provided by Embedded Computing Design. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by Embedded Computing Design or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://ppacc.player.fm/legal.

Send us a text

On this episode of Embedded Insiders, Ken sits down with Rozalia Beica, Field CTO at Rapidus Corporation, to explore the rise of chiplet integration, Rapidus' U.S. expansion, the transformative role of AI in semiconductors, and the growing importance of advanced packaging in the industry. Stay tuned for insights into how Rapidus is shaping the future of semiconductor technology.

Next, Ken discusses how customer experience centers are driving innovation in complex embedded systems.

But first, Rich and Ken highlight some important industry news involving, you guessed it, AI. They’re also sharing some information ahead of embedded world 2025

For more information, visit embeddedcomputing.com

  continue reading

269 episodes

All episodes

×
 
Loading …

Welcome to Player FM!

Player FM is scanning the web for high-quality podcasts for you to enjoy right now. It's the best podcast app and works on Android, iPhone, and the web. Signup to sync subscriptions across devices.

 

Quick Reference Guide

Listen to this show while you explore
Play